Fundamentals of Heat and Mass Transfer
Fundamentals of Heat and Mass Transfer
7th Edition
ISBN: 9780470501979
Author: Frank P. Incropera, David P. DeWitt, Theodore L. Bergman, Adrienne S. Lavine
Publisher: Wiley, John & Sons, Incorporated
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Chapter 1, Problem 1.16P

A square silicon chip ( k = 150 W/m K ) is of width w = 5 mm on a side and of thickness t = 1 mm . Thechip is mounted in a substrate such that its side andhack surfaces are insulated, while the front surface isexposed to a coolant. If 4 W are being dissipated in circuits mounted to the back surface of the chip, what isthe steady-state temperature difference between back and front surfaces?
Chapter 1, Problem 1.16P, A square silicon chip (k=150W/mK) is of width w=5mm on a side and of thickness t=1mm . Thechip is

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Chapter 1 Solutions

Fundamentals of Heat and Mass Transfer

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