A square silicon chip
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Chapter 1 Solutions
Fundamentals of Heat and Mass Transfer
- What are the Conduction from Fluid to Fluid Fomulas?arrow_forwardSipho’s mother is making a fire in the stove inside a shack using coal. A fan is used to extract the flue gasfrom the fire via a chimney made of zinc material. The wall thickness of Chimney is L=4mm and the walltemperature of the chimney on the flue gas side is T_si=60˚C. Sipho, playing outside next to the chimneyexperiences an ambient temperature of 20˚C. The surrounding temperature is T_sur=35˚C and the emissivityis ε=0.95. Assume the convection coefficient is 20W/m2K and the chimney is grey material.Under these conditions determine the outer surface (air side) temperature T_so=? of the chimney.arrow_forwardDetermine the thermal resistance of the radiator R, if the maximum allowable processor temperature TCPU equals 73 C, maximum allowable radiator 21x 10, clock frequency temperature 38° C, heatcapacity radiator 3,6x 10, voltage1,3. температураarrow_forward
- The thermal conductivities of wood is kwood = 0.1W/(m°C)and air is kair = 0.0234W/(m°C). Part A If the temperature of the room is 20°C and outside is 10°C, find the rate of heat flow for a wall of wood with area = 10 m² and thickness of 5cm. O 60 W O 304 W O 34 W O 200 W O 100 W Submit Request Answer Part B The wall of wood with thickness of 5cm is now replaced with two layers of wood and a gap of air between the wood. Each layer of wood has a 2.5cm thickness and the gap is 1cm. The rate of heat flow will, decreases. increases. stay the same. Submit Request Answer Part C The temperature in the air gap will be, O 20°C, between 10°C and 20°C, O 10°C,arrow_forwardThe surface area of an unclothed person is 1.5m ^2 and thier skin tempature is 33 degree celcius. This ideal person is located in a room with a tempature of 65 dregrees F. and has an emissivity of e=0.95 suppose the room has dimensions 4mx9mx18m a) suppose you and your closest 10 friends come into this room and heat it up. suppose your clothes are in equilibium with your skin and have the same tempature and emissivity. Further suppose that your net power into the room remains constant . How long does it take before the room to get to hot say 95 degreesarrow_forwardA heating element made of tungsten wire connected to a large battery that has negligible internal resistance. When the heating element reaches 80.0°C, it consumes electrical energy at a rate of 480 W. Assume that the temperature coefficient of resistivity has the value given in Table 25.2 in the textbook and that it is constant over the temperature range in this problem. In the equation R(T) = Ro [1 + a(T - To)] take To to be 20.0°C. Part A What is its power consumption when the temperature of the heating element is 110.0°C? Express your answer with the appropriate units. P = Submit Value Provide Feedback Request Answer Units ?arrow_forward
- 6. a. The heat flux applied to the walls of the biomass combustion furnace is 20 W/m2. The furnace walls have a thickness of 10 mm and a thermal conductivity of 12 W/m.K. If the wall surface temperature is measured to be 50oC on the left and 30oC on the right, prove that conduction heat transfer occurs at a steady state!b. Heating the iron cylinder on the bottom side is done by placing the iron on the hotplate. This iron has a length of 20 cm. The surface temperature of the hotplate is set at 300oC while the top side of the iron is in contact with the still outside air. To reach the desired hotplate temperature, it takes 5 minutes. Then it takes 15 minutes to measure the temperature of the upper side of the iron cylinder at 300oC. Show 3 proofs that heat transfer occurs transientlyarrow_forwardQUESTION 1 a) A silicon chip is cooled by passing nanocoolant through microchannels etched in the back of the chip, as shown in Figure Q1. The channels are covered with a silicon cap. Consider a 11 mm and 11 mm square chip in which N = 50 rectangular microchannels, each of width W = 40 µm and height H = 160 µm have been etched. Nanocoolant enters the microchannels at a temperature T; = 290 K, and a total flow rate of 0.005 kg/s. The chip and cap are maintained at a uniform temperature of 340 K. Assuming that the flow in the channels is fully developed and all the heat generated by the circuits on the top surface of the chip is transferred to the nanocoolant, determine the rate of heat transfer through the rectangular microchannel. Assume nanocoolant as water properties at 25 °C. 11 mm 1 T. Circuits generating power W. 11 mm Chip, T; Сар, Т, H W Figure Q1 b) A desktop computer is to be cooled by a fan. The electronic components of the computer consume 100 W of power under full-load…arrow_forwardConsider a flat plate or a plane wall with a thickness L and a long cylinder of radius r0. Both of these are made of materials such that they can be treated as lumped capacitances (Bi0.1). Show that in each case, the characteristic length lc, defined lc=(V/As), can be approximated as (L/2) and (ro/2), respectively.arrow_forward
- Shape Factor Conduction Problem A cylindrical pipeline that is used for the transport of crude oil is buried in the soil horizontally such that its centerline is 1.5 m (z) below the surface. The pipe has the outer diameter of 0.5 m (D) and is coated with a 100 mm thick layer of glass insulation on the outside. Assume that heated oil at 120 °C flows through the pipe and the soil surface temperature is at 0 °C (T:). The soil thermal conductivity is known as 0.5 W/m-K, and the glass insulation thermal conductivity is known as 0.07 W/m-K. What is the rate of heat loss per unit length of the pipe (W/m)? T2 Soil Glass insulation Oil, T1arrow_forwardA rectangular electrical heater is attached to a metal sheet. Measurements show the surface temperatures of T1, T2, T3 are 55, 60 and 42 °C, respectively. Both sides of the heater and metal sheet are exposed to an environment where h is equal, and T∞ = 23 °C. Assume K values & you can neglect the contact resistance. a. Find the value of h.b. Find the value of the volumetric heat generation.c. Draw the sketch of the temperature as a function of the direction of heat dissipation.d. What is the exact location of the maximum temperature in the plate-heater assembly?e. If h = 230 W/m2K, q_dot = 1 x 103 W/m3, what is the maximum temperature in the heater?arrow_forwardA square silicon chip (k = 150 W/m • K) has side width w = 5 mm and thickness z = 1 mm.The chip is mounted on a substrate so that its sides and interior surface are insulated. whilethat the front surface is exposed to a cooling fluid.If 4 W is dissipated from the circuitry mounted on the back surface of the chip, what is the difference insteady-state temperatures between the bottom and front surfaces?arrow_forward
- Principles of Heat Transfer (Activate Learning wi...Mechanical EngineeringISBN:9781305387102Author:Kreith, Frank; Manglik, Raj M.Publisher:Cengage Learning