Summarize examples 1.1 by determining the statement of the problem, objectives, choice of the response, variable, factors, design process. thank you
Summarize examples 1.1 by determining the statement of the problem, objectives, choice of the response, variable, factors, design process. thank you
Practical Management Science
6th Edition
ISBN:9781337406659
Author:WINSTON, Wayne L.
Publisher:WINSTON, Wayne L.
Chapter2: Introduction To Spreadsheet Modeling
Section: Chapter Questions
Problem 20P: Julie James is opening a lemonade stand. She believes the fixed cost per week of running the stand...
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Summarize examples 1.1 by determining the statement of the problem, objectives, choice of the response, variable, factors, design process.
thank you
![3. Layout of the components on the board
4. Operator
5. Production rate.
A flow solder machine is used in the manufacturing process
for printed circuit boards. The machine cleans the boards in
a flux, preheats the boards, and then moves them along a
conveyor through a wave of molten solder. This solder
process makes the electrical and mechanical connections
for the leaded components on the board.
The process currently operates around the I percent defec-
tive level. That is, about I percent of the solder joints on a
board are defective and require manual retouching. However,
because the average printed circuit board contains over 2000
solder joints, even a l percent defective level results in far too
many solder joints requiring rework. The process engineer
responsible for this area would like to use a designed experi-
ment to determine which machine parameters are influential
in the occurrence of solder defects and which adjustments
should be made to those variables to reduce solder defects.
In this situation, engineers are interested in character-
izing the flow solder machine; that is, they want to deter-
mine which factors (both controllable and uncontrollable)
affect the occurrence of defects on the printed circuit
boards. To accomplish this, they can design an experiment
that will enable them to estimate the magnitude and direc-
tion of the factor effects; that is, how much does the
response variable (defects per unit) change when each fac-
tor is changed, and does changing the factors together
produce different results than are obtained from individual
factor adjustments-that is, do the factors interact?
Sometimes we call an experiment such as this a screening
experiment. Typically, screening or characterization exper-
iments involve using fractional factorial designs, such as in
the golf example in Figure 1.8.
The information from this screening or characterization
experiment will be used to identify the critical process fac-
tors and to determine the direction of adjustment for these
factors to reduce further the number of defects per unit. The
experiment may also provide information about which fac-
tors should be more carefully controlled during routine man-
ufacturing to prevent high defect levels and erratic process
performance. Thus, one result of the experiment could be the
application of techniques such as control charts to one or
more process variables (such as solder temperature), in
addition to control charts on process output. Over time, if the
process is improved enough, it may be possible to base most
of the process control plan on controlling process input vari-
ables instead of control charting the output.
The flow solder machine has several variables that can
be controlled. They include
1. Solder temperature
2. Preheat temperature
3. Conveyor speed
4. Flux type
5. Flux specific gravity
6. Solder wave depth
7. Conveyor angle.
In addition to these controllable factors, several other factors
cannot be casily controlled during routine manufacturing,
although they could be controlled for the purposes of a test.
They are
1. Thickness of the printed circuit board
2. Types of components used on the board](/v2/_next/image?url=https%3A%2F%2Fcontent.bartleby.com%2Fqna-images%2Fquestion%2Ff326d7f6-07f3-4f16-b38f-4ec97c714e2c%2Faba1a575-15b4-42cc-ad91-d8a1cf7518e4%2Fgrnwg3f_processed.jpeg&w=3840&q=75)
Transcribed Image Text:3. Layout of the components on the board
4. Operator
5. Production rate.
A flow solder machine is used in the manufacturing process
for printed circuit boards. The machine cleans the boards in
a flux, preheats the boards, and then moves them along a
conveyor through a wave of molten solder. This solder
process makes the electrical and mechanical connections
for the leaded components on the board.
The process currently operates around the I percent defec-
tive level. That is, about I percent of the solder joints on a
board are defective and require manual retouching. However,
because the average printed circuit board contains over 2000
solder joints, even a l percent defective level results in far too
many solder joints requiring rework. The process engineer
responsible for this area would like to use a designed experi-
ment to determine which machine parameters are influential
in the occurrence of solder defects and which adjustments
should be made to those variables to reduce solder defects.
In this situation, engineers are interested in character-
izing the flow solder machine; that is, they want to deter-
mine which factors (both controllable and uncontrollable)
affect the occurrence of defects on the printed circuit
boards. To accomplish this, they can design an experiment
that will enable them to estimate the magnitude and direc-
tion of the factor effects; that is, how much does the
response variable (defects per unit) change when each fac-
tor is changed, and does changing the factors together
produce different results than are obtained from individual
factor adjustments-that is, do the factors interact?
Sometimes we call an experiment such as this a screening
experiment. Typically, screening or characterization exper-
iments involve using fractional factorial designs, such as in
the golf example in Figure 1.8.
The information from this screening or characterization
experiment will be used to identify the critical process fac-
tors and to determine the direction of adjustment for these
factors to reduce further the number of defects per unit. The
experiment may also provide information about which fac-
tors should be more carefully controlled during routine man-
ufacturing to prevent high defect levels and erratic process
performance. Thus, one result of the experiment could be the
application of techniques such as control charts to one or
more process variables (such as solder temperature), in
addition to control charts on process output. Over time, if the
process is improved enough, it may be possible to base most
of the process control plan on controlling process input vari-
ables instead of control charting the output.
The flow solder machine has several variables that can
be controlled. They include
1. Solder temperature
2. Preheat temperature
3. Conveyor speed
4. Flux type
5. Flux specific gravity
6. Solder wave depth
7. Conveyor angle.
In addition to these controllable factors, several other factors
cannot be casily controlled during routine manufacturing,
although they could be controlled for the purposes of a test.
They are
1. Thickness of the printed circuit board
2. Types of components used on the board
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