7- The uniformity of a silicon wafer following an etching process is determined by measuring the layer thickness at several locations and expressing uniformity as the range of the thicknesses. Table 6E.29 presents uniformity determinations for 30 consecutive wafers processed through the etching tool. TABLE 6E.29 Uniformity Data for Exercise 6.71 Wafer Uniformity Wafer Uniformity 11 16 16 17 22 18 14 19 34 20 22 21 13 11 10 11 14 15 6 11 11 23 14 12 22 23 24 25 26 27 28 29 30 15 16 12 11 18 14 13 18 12 13 12 15 21 21 14 (a) Is there evidence that uniformity is normally distributed? If not, find a suitable transformation for the data. (b) Construct a control chart for individuals and a moving range control chart for uniformity for the etching process. Is the process in statistical control?
7- The uniformity of a silicon wafer following an etching process is determined by measuring the layer thickness at several locations and expressing uniformity as the range of the thicknesses. Table 6E.29 presents uniformity determinations for 30 consecutive wafers processed through the etching tool. TABLE 6E.29 Uniformity Data for Exercise 6.71 Wafer Uniformity Wafer Uniformity 11 16 16 17 22 18 14 19 34 20 22 21 13 11 10 11 14 15 6 11 11 23 14 12 22 23 24 25 26 27 28 29 30 15 16 12 11 18 14 13 18 12 13 12 15 21 21 14 (a) Is there evidence that uniformity is normally distributed? If not, find a suitable transformation for the data. (b) Construct a control chart for individuals and a moving range control chart for uniformity for the etching process. Is the process in statistical control?
Applications and Investigations in Earth Science (9th Edition)
9th Edition
ISBN:9780134746241
Author:Edward J. Tarbuck, Frederick K. Lutgens, Dennis G. Tasa
Publisher:Edward J. Tarbuck, Frederick K. Lutgens, Dennis G. Tasa
Chapter1: The Study Of Minerals
Section: Chapter Questions
Problem 1LR
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Transcribed Image Text:7-
The uniformity of a silicon wafer following an etching process is determined by measuring the layer thickness at
several locations and expressing uniformity as the range of the thicknesses. Table 6E.29 presents uniformity
determinations for 30 consecutive wafers processed through the etching tool.
■ TABLE 6E.29
Uniformity Data for Exercise 6.71
Wafer Uniformity Wafer Uniformity
11
16
15
16
17
16
22
18
12
14
34
22
7
8
9
10
11
15
13
11
6
11
11
14
12
7
19
20
21
22
23
24
25
26
27
28
29
30
11
18
14
13
18
12
13
12
15
21
21
14
(a) Is there evidence that uniformity is normally distributed? If not, find a suitable transformation for the data.
(b) Construct a control chart for individuals and a moving range control chart for uniformity for the etching
process. Is the process in statistical control?
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